DocumentCode :
1980230
Title :
Increase of parasitic resistance of p-MOSFETs due to nitrogen atoms incorporation into silicon substrate by N/sub 2/O-oxynitride gate dielectrics process
Author :
Takayanagi-Takagi, M. ; Yoshimura, H. ; Toyoshima, Y.
Author_Institution :
Electron Device Eng. Lab., Toshiba Corp., Yokohama, Japan
fYear :
1997
fDate :
10-10 Dec. 1997
Firstpage :
235
Lastpage :
238
Abstract :
In this paper, we study the characteristics of MOSFETs with N/sub 2/O-oxynitride gate dielectrics, shallow junctions and TiSi/sub 2/ source/drain diffusions in order to investigate the overall impact of N/sub 2/O-oxynitride gate dielectrics on high performance CMOSFETs. It is demonstrated that, in addition to the mobility degradation, an increase of parasitic resistance in gate-overlapped source/drain region by the nitrogen donors contributes to the reduction of current drivability, especially in p-MOSFETs.
Keywords :
MOSFET; carrier mobility; dielectric thin films; diffusion; nitrogen compounds; semiconductor device reliability; CMOSFETs; N/sub 2/O-Si; Si; current drivability; gate-overlapped source/drain region; mobility degradation; oxynitride gate dielectrics; p-MOSFETs; parasitic resistance; shallow junctions; source/drain diffusions; Boron; CMOS technology; CMOSFETs; Degradation; Dielectric substrates; MOSFET circuits; Nitrogen; Silicides; Silicon; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1997. IEDM '97. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4100-7
Type :
conf
DOI :
10.1109/IEDM.1997.650359
Filename :
650359
Link To Document :
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