Plastic encapsulated microcircuits (PEMs) in the MIDS program

Smaller availability of military component sources in Europe led to an earlier need to incorporate PEMs in military equipment, including avionics. Processes enabling approval of some non-MIL parts in the design of military equipment have long been used provided that the suitability of parts to their application (including environment) is properly demonstrated. Resulting from the US DOD procurement reform of 1994 (Perry initiative), PEMs were authorized to use in the MIDS terminal design in 1994. MIDSCO´s Parts Control Program Plan, was then revised and approved by the IPO to recommend preferably the use of PEMs and of commercial components in the industrial temperature range (-40°C, +85°C). Thomson-CSF incorporated in its design as many PEMs as practical for the items under its responsibility (receiver/synthesizer SRUs and external power supply LRUs). Thomson-CSF also shared with the other subcontractors the lessons of the “Plan Composants Plastiques” to facilitate the use of these components in the MIDS program, and, slowly, this approach gained acceptance. Currently, Thomson-CSF uses only 2% of MIL parts in its MIDS terminal share. 50% of the non-MIL parts being PEMs. The main key to the success of PEMs in the MIDS program is the success of the design efforts in thermal management and reduction of power dissipation. This made it possible to use these components in the highly demanding environments of uninhabited airborne fighters while staying within the limits of the components specifications with adequate margins and to collect all possible benefits from the use of PEMs