DocumentCode :
1981707
Title :
Fuzzy control for one kind of curing process
Author :
XinJiang, Lu ; Han-Xiong, Li
Author_Institution :
Dept. of Manuf. Eng & Eng Manage., City Univ. of Hong Kong, Hong Kong
fYear :
2009
fDate :
11-13 May 2009
Firstpage :
66
Lastpage :
70
Abstract :
In this paper, fuzzy control is proposed to control one kind of nonlinear curing process. The nonlinear curing process is firstly approximately modeled by the T-S fuzzy model, upon which fuzzy control is designed to guarantee the process stability and achieve the Hinfin tracking performance. Finally, the proposed method is applied to control the temperature profile of a practical curing process.
Keywords :
Hinfin control; curing; electronics packaging; fuzzy control; stability; temperature control; Hinfin tracking; T-S fuzzy model; fuzzy control; nonlinear curing process; process stability; semiconductor packaging industry; temperature profile control; Control systems; Curing; Fuzzy control; Fuzzy logic; Fuzzy systems; Heat transfer; Nonlinear control systems; Packaging; Process control; Temperature control; Curing process; Fuzzy control; Process control; Robust control; T-S model;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computational Intelligence for Measurement Systems and Applications, 2009. CIMSA '09. IEEE International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3819-8
Electronic_ISBN :
978-1-4244-3820-4
Type :
conf
DOI :
10.1109/CIMSA.2009.5069920
Filename :
5069920
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1981707
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