• DocumentCode
    1981997
  • Title

    In-situ Microwave Characterization of Medium-k HfO2 and High-k STO Dielectrics for MIM Capacitors Integrated in Back-End of Line of IC

  • Author

    Vo, T.T. ; Lacrevaz, Thierry ; Flechet, Bernard ; Farcy, A. ; Morand, Yves ; Blonkowski, S. ; Torres, Juana

  • Author_Institution
    IMEP-LAHC CNRS 5310, Univ. de Savoie, Le Bourget
  • fYear
    2007
  • fDate
    11-14 Dec. 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The complex permittivity microwave characterization of medium-k materials as HfO2 and high-k materials as STO is presented. The characterization method, using coplanar or microstrip waveguides, allows a large band characterization, from 40 MHz to 40 GHz. It also allows investigating these materials with large scale thickness, from 10 nm up to 500 nm, in a configuration which can be very close to their final integration in an advanced damascene architecture of MIM capacitor. We show that the permittivity of such materials can be process and frequency-dependent.
  • Keywords
    MIM devices; capacitors; coplanar waveguides; hafnium compounds; microwave integrated circuits; HfO2; complex permittivity microwave characterization; coplanar waveguides; frequency 40 MHz to 40 GHz; high-k STO dielectrics; in-situ microwave characterization; integrated circuit; medium-k HfO2; metal insulator metal capacitors; microstrip waveguides; Coplanar waveguides; Dielectrics and electrical insulation; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; MIM capacitors; Permittivity; Radio frequency; Testing; Waveguide components; HfO2; MIM capacitor; PZT; STO; coplanar waveguide; high-k dielectric; loss tangent; medium-k dielectric; microstrip waveguide; microwave characterization; propagation exponent; scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2007. APMC 2007. Asia-Pacific
  • Conference_Location
    Bangkok
  • Print_ISBN
    978-1-4244-0748-4
  • Electronic_ISBN
    978-1-4244-0749-1
  • Type

    conf

  • DOI
    10.1109/APMC.2007.4555089
  • Filename
    4555089