• DocumentCode
    1983259
  • Title

    On the performance gain of multiple cell-site processing in randomly spread DS-CDMA cellular systems

  • Author

    Zaidel, Benjamin M. ; Somekh, Oren ; Shamai, Shlomo

  • Author_Institution
    Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
  • fYear
    2004
  • fDate
    6-7 Sept. 2004
  • Firstpage
    219
  • Lastpage
    222
  • Abstract
    We consider a chip-interleaved randomly spread DS-CDMA scheme employed in two variants of A.D. Wyner\´s infinite linear cell-array model (IEEE Trans. Inform. Theory, vol.40, no.6, p.1713-27, 1994) with flat fading. Focusing on the asymptotic setup in which both the number of users per cell and the processing gain go to infinity, while their ratio (the "cell load") goes to some finite constant, the spectral efficiencies of the optimum and linear MMSE joint multi-cell receivers are considered. Dramatic performance enhancement as compared to single-cell-site processing is demonstrated. The asymptotic behavior of the two receivers in extreme SNR regimes and in a high cell-load setup are analyzed as well. The impact of chip-interleaving vs. symbol-interleaving is also investigated. Chip-level interleaving is found beneficial in several cases of interests, and it is conjectured to be beneficial in general.
  • Keywords
    cellular radio; code division multiple access; fading channels; least mean squares methods; multiuser channels; radio receivers; spread spectrum communication; MMSE receivers; Wyner infinite linear cell-array model; chip-interleaving; flat fading; multi-cell receivers; multiple cell-site processing; multiuser receivers; randomly spread DS-CDMA cellular systems; spectral efficiency; symbol-interleaving; Direct-sequence code-division multiple access; Fading; H infinity control; Interference; Interleaved codes; Multiaccess communication; Performance gain; TEM cells; Throughput; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Electronics Engineers in Israel, 2004. Proceedings. 2004 23rd IEEE Convention of
  • Print_ISBN
    0-7803-8427-X
  • Type

    conf

  • DOI
    10.1109/EEEI.2004.1361129
  • Filename
    1361129