• DocumentCode
    1988014
  • Title

    Direct bonding for true All Quartz Package and new resonator designs

  • Author

    Vallin, Örjan ; Rangsten, Pelle

  • Author_Institution
    Angstrom Lab., Uppsala Univ., Sweden
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    804
  • Abstract
    We present the direct bonding method of monocrystalline quartz. Demonstrator devices were designed to show the process compatibility of etching, patterning of electrodes and direct bonding for a true All Quartz Package. The ability to unite different crystallographic directions makes interesting laminates
  • Keywords
    crystal resonators; laminates; packaging; quartz; wafer bonding; All Quartz Package; SiO2; direct bonding; electrode patterning; etching; laminate; monocrystalline quartz; resonator design; Chemicals; Electrodes; Etching; Hermetic seals; Laminates; Packaging; Silicon on insulator technology; Surface contamination; Temperature; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
  • Conference_Location
    Besancon
  • ISSN
    1075-6787
  • Print_ISBN
    0-7803-5400-1
  • Type

    conf

  • DOI
    10.1109/FREQ.1999.841427
  • Filename
    841427
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1988014