• DocumentCode
    1989487
  • Title

    Comparison of ballistic transport characteristics of monolayer transition metal dichalcogenides (TMDs) MX2 (M = Mo, W; X = S, Se, Te) n-MOSFETs

  • Author

    Jiwon Chang ; Register, Leonard F. ; Banerjee, Sanjay K.

  • Author_Institution
    Microelectron. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
  • fYear
    2013
  • fDate
    3-5 Sept. 2013
  • Firstpage
    408
  • Lastpage
    411
  • Abstract
    We study the transport properties of monolayer transition metal Dichalcogenides (TMDs) MX2 (M = Mo, W; X = S, Se, Te) n-channel metal-oxide-semiconductor field effect transistors (MOSFETs) using an atomistic tight-binding full-band ballistic quantum transport simulations, with hopping potentials obtained from density functional theory. We discuss the subthreshold slope (SS), drain-induced barrier lowering (DIBL), as well as gate-induced drain leakage (GIDL) for different monolayer MX2 MOSFETs. We also report the possibility of negative differential resistance to the extent quasi-ballistic transport exists in such nanostructure TMD MOSFETs.
  • Keywords
    MOSFET; ballistic transport; density functional theory; molybdenum compounds; monolayers; semiconductor device models; tungsten compounds; DIBL; MOSFET; MoS2; MoSe2; MoTe2; TMD; WS2; WSe2; WTe2; atomistic tight binding full band ballistic quantum transport; ballistic transport; density functional theory; drain-induced barrier lowering; gate-induced drain leakage; monolayer transition metal dichalcogenides; n-channel metal-oxide-semiconductor field effect transistors; negative differential resistance; subthreshold slope; Atomic layer deposition; Dielectric constant; Logic gates; MOSFET; MOSFET circuits; Metals; Photonic band gap; atomistic; quantum transport; transiton metal dichalcogenides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices (SISPAD), 2013 International Conference on
  • Conference_Location
    Glasgow
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4673-5733-3
  • Type

    conf

  • DOI
    10.1109/SISPAD.2013.6650661
  • Filename
    6650661