DocumentCode :
1989523
Title :
Correlation of frequency hopped VCO phase settling to varactor transient capacitance
Author :
Mallette, L.A. ; Delaney, M.J. ; Killman, S. ; Folk, T. ; Wong, B.
Author_Institution :
Hughes Space & Commun., Los Angeles, CA, USA
Volume :
2
fYear :
1999
fDate :
1999
Firstpage :
1133
Abstract :
Microwave VCO and system designers should be aware that attoFarad level changes in the dynamic performance of a varactor can correlate to changes in system settling response of fast hopping frequency synthesizers. It is theorized that a moisture/silicon interaction occurred within a packaged varactor diode due to imperfect wafer processing of the die and a flawed ceramic enclosure. The flawed ceramic allowed ambient moisture to penetrate and come in contact with exposed silicon at the surface of the die junction, causing an increase in interface (or surface) states which in turn increased the settling time constant of diode capacitance on the order of fifty microseconds. The increased time constant was correlated to an observed degradation in VCO phase settling. The increased phase transient was shown to recover with several time/temperature combinations in accordance with Arrhenius predictions
Keywords :
capacitance; ceramic packaging; frequency synthesizers; microwave oscillators; transient response; varactors; voltage-controlled oscillators; 4.5 GHz; Arrhenius predictions; VCO phase settling; fast hopping frequency synthesizers; flawed ceramic enclosure; imperfect wafer processing; increased phase transient; microwave VCO; moisture/silicon interaction; packaged varactor diode; system settling response; vacuum bake; varactor dynamic performance; varactor transient capacitance; Capacitance; Ceramics; Degradation; Diodes; Frequency synthesizers; Moisture; Packaging; Silicon; Varactors; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency and Time Forum, 1999 and the IEEE International Frequency Control Symposium, 1999., Proceedings of the 1999 Joint Meeting of the European
Conference_Location :
Besancon
ISSN :
1075-6787
Print_ISBN :
0-7803-5400-1
Type :
conf
DOI :
10.1109/FREQ.1999.841524
Filename :
841524
Link To Document :
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