• DocumentCode
    1990117
  • Title

    Anomalous Narrow Width Effect in NMOS and PMOS Surface Channel Transistors Using Shallow Trench Isolation

  • Author

    Lau, W.S. ; See, K.S. ; Eng, C.W. ; Awl, W.K. ; Jo, K.H. ; Tee, K.C. ; Lee, James Y M ; Quek, Elgin K B ; Kim, H.S. ; Chan, Simon T H ; Chan, L.

  • Author_Institution
    Nanyang Technological University, School of Electrical and Electronic Engineering, Division of Microelectronics, Block S2.1, Nanyang Avenue, Singapore, 639798 E-mail: ewslau@ntu.edu.sg
  • fYear
    2005
  • fDate
    19-21 Dec. 2005
  • Firstpage
    773
  • Lastpage
    776
  • Abstract
    NMOS surface-channel transistors using shallow trench isolation (STI) is known to show reverse narrow width effect (RNWE) such that the threshold voltage becomes smaller when the channel width decreases. We found that by using a phosphorus deep S/D implant in addition to an arsenic deep S/D implant, the threshold voltage first becomes larger when the channel width decreases and then later becomes smaller when the channel width further decreases for NMOS transistors with very small gate lengths. We attribute such an anomalous narrow width effect to an enhancement of TED due to Si interstitials generated by the phosphorus implant. PMOS transistors show up a much stronger anomalous narrow width effect compared to NMOS transistors. We attribute such an anomalous narrow width effect to an enhancement of phosphorus and arsenic TED due to Si interstitials generated by the deep boron S/D implant.
  • Keywords
    Boron; CMOS logic circuits; Energy consumption; Implants; Isolation technology; MOS devices; MOSFETs; Random access memory; Threshold voltage; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2005 IEEE Conference on
  • Print_ISBN
    0-7803-9339-2
  • Type

    conf

  • DOI
    10.1109/EDSSC.2005.1635391
  • Filename
    1635391