Theoretical and experimental aspects in the depositing process of solder and adhesive pastes in surface mount technology

The paper contributes to a detailed comparison of some materials, like solder pastes and conductive adhesives, used in the assembling technology process of the electronic components, on interconnecting supports. The study dealt also with the analyze of different geometrical configurations, in the depositing processes of the above-mentioned materials. The goal is to determine an optimum correlation of the functional parameters, for the depositing process, in realizing prototype and low manufacturing series applications. The study is focused only on the technology process in depositing materials, for interconnecting components and electronic modules, the other steps in the technological flow being considered only like input and output data. From all known technological processes, it was selected the one adapted to our purpose and it were established the necessary physical and technical parameters. By these means, we have studied the physical properties of the materials, pointing out their characteristics and the influence of these ones on the depositing process. It were made critical observations, concerning the validity of the proposed models and it were pointed out the further researches that we must conduct, in order to obtain better practical results.