Laser processing of flexible substrates

Author

Gordon, Peter ; Berenyi, Richard ; Nyitra, Zsolt

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary

fYear

2002

fDate

2002

Firstpage

183

Lastpage

187

Abstract

The paper describes some results of a research project aimed at the application of CO₂ and frequency multiplied Nd:YAG lasers for drilling via holes into copper clad flexible laminates of polyimide and polyester based materials. We have also carried out experiments for removing the insulation layer from the copper foil to open windows, i.e. to obtain clean copper areas. This can be a key process in the production of TABs. Three wavelengths (10600 nm, 1064 nm and 355 nm) were used to find the optimal process parameters for drilling and layer removing. The samples were examined and evaluated many ways to conclude the general behaviour of the material and its interaction with different laser beams.

Keywords

copper; integrated circuit interconnections; integrated circuit packaging; laminates; laser beam machining; laser materials processing; substrates; tape automated bonding; 10600 nm; 1064 nm; 355 nm; CO₂; CO₂ lasers; Cu; Cu clad flexible laminates; Cu foil; TAB; YAG:Nd; YAl5O12:Nd; flexible substrates; frequency multiplied Nd:YAG lasers; insulation layer removal; laser processing; optimal process parameters; polyester based materials; polyimide based materials; via hole drilling; Copper; Drilling; Insulation; Integrated circuit interconnections; Laser beam cutting; Laser beams; Laser modes; Optical materials; Polyimides; Production;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2002. POLYTRONIC 2002. 2nd International IEEE Conference on

Print_ISBN

0-7803-7567-X

Type

conf

DOI

10.1109/POLYTR.2002.1020207

Filename

1020207