• DocumentCode
    1990677
  • Title

    A field programmable multi-chip module (FPMCM)

  • Author

    Darnauer, Joel ; Garay, P. ; Isshiki, Tsuyoshi ; Ramirez, John ; Dai, Wayne Wei-Ming

  • Author_Institution
    Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
  • fYear
    1994
  • fDate
    10-13 Apr 1994
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Multi-chip module (MCM) packaging can reduce the cost and increase the utility of field programmable systems. We are currently developing a first generation field programmable multi-chip module (FPMCM) as a test vehicle for a particular MCM technology. We present the advantages of MCM for field programmable systems and develop analytical models for estimating the capacity of FPMCM architectures based on Rent´s rule. These models are used to generate the architecture of our first generation prototype which employs smaller FPGA die and a mixture of direct and switched interconnect. We conclude with a discussion of the challenges and opportunities that FPMCMs face
  • Keywords
    logic arrays; multichip modules; FPMCM; Rent´s rule; field programmable multi-chip module; packaging; Aging; Assembly; Costs; Dielectric substrates; Field programmable gate arrays; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Printed circuits; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    FPGAs for Custom Computing Machines, 1994. Proceedings. IEEE Workshop on
  • Conference_Location
    Napa Valley, CA
  • Print_ISBN
    0-8186-5490-2
  • Type

    conf

  • DOI
    10.1109/FPGA.1994.315592
  • Filename
    315592