DocumentCode
1990677
Title
A field programmable multi-chip module (FPMCM)
Author
Darnauer, Joel ; Garay, P. ; Isshiki, Tsuyoshi ; Ramirez, John ; Dai, Wayne Wei-Ming
Author_Institution
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
fYear
1994
fDate
10-13 Apr 1994
Firstpage
1
Lastpage
10
Abstract
Multi-chip module (MCM) packaging can reduce the cost and increase the utility of field programmable systems. We are currently developing a first generation field programmable multi-chip module (FPMCM) as a test vehicle for a particular MCM technology. We present the advantages of MCM for field programmable systems and develop analytical models for estimating the capacity of FPMCM architectures based on Rent´s rule. These models are used to generate the architecture of our first generation prototype which employs smaller FPGA die and a mixture of direct and switched interconnect. We conclude with a discussion of the challenges and opportunities that FPMCMs face
Keywords
logic arrays; multichip modules; FPMCM; Rent´s rule; field programmable multi-chip module; packaging; Aging; Assembly; Costs; Dielectric substrates; Field programmable gate arrays; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Printed circuits; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
FPGAs for Custom Computing Machines, 1994. Proceedings. IEEE Workshop on
Conference_Location
Napa Valley, CA
Print_ISBN
0-8186-5490-2
Type
conf
DOI
10.1109/FPGA.1994.315592
Filename
315592
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