DocumentCode :
1992909
Title :
A 3-dimensional model of internal charging simulation
Author :
Xiao-Jin Tang ; Zhong Yi ; Chao Zhang ; Ye-Nan Liu ; Zhi-Hao Wang ; Li-Fei Meng ; Jian-Guo Huang
Author_Institution :
Sci. & Technol. on Reliability & Environ. Eng. Lab., Beijing Inst. of Spacecraft Environ. Eng., Beijing, China
fYear :
2013
fDate :
23-27 Sept. 2013
Firstpage :
1
Lastpage :
6
Abstract :
To break through the limitation of the traditional 1-dimensional (1-D) method of internal charging computation, a 3-D calculation model of internal electric field and potential for arbitrary configuration dielectric with complex boundary conditions is developed. It includes two steps: 3-D electron transport simulation and internal electric field computation. The transport simulation, which aims for obtaining electron deposition and dose rate distribution, is implemented by a self-developed software founded on GEANT4. And the calculation of 3-D internal electric field, which takes above transport results as input, is conducted through solving a set of electrostatic equations by the software COMSOL Multiphysics. In this paper, this 3-D simulation model applied to a typical printed circuit board grounded on a rectangular circuit and cylindrical pin will be presented. For purpose of comparison, a simpler 1-D planar dielectric wholly grounded on the back surface is simulated in the same method. Finally, the electric field computed by the 3-D algorithm is much larger than the 1-D simplified method widely used at present and hence the 1-D method may neglect crucial risk. Besides, the following conclusions are drawn: grounding has significant influence on electric field distribution, and the maximum field generally occurs at grounding edges or corners. Increasing the curvature radius of the circuit corner can reduce the field and the discharge risk.
Keywords :
electric fields; electron transport theory; integrated circuit modelling; printed circuits; three-dimensional integrated circuits; 3D calculation model; 3D electron transport simulation; 3D model; COMSOL multiphysics; GEANT4; boundary conditions; curvature radius; cylindrical pin; dose rate distribution; electric field distribution; electron deposition; electrostatic equations; grounding corners; grounding edges; internal charging simulation; internal electric field; planar dielectric; printed circuit board; rectangular circuit; Computational modeling; Dielectrics; Electric fields; Grounding; Integrated circuit modeling; Mathematical model; Solid modeling; 3-D simulation; GEANT4; internal charging; internal electric field;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radiation and Its Effects on Components and Systems (RADECS), 2013 14th European Conference on
Conference_Location :
Oxford
Type :
conf
DOI :
10.1109/RADECS.2013.6937417
Filename :
6937417
Link To Document :
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