Title :
Determination of the temperature coefficient piezoelectric constant TCe33 to improve thermal 1D acoustic tool for BAW resonator design
Author :
Petit, D. ; Gautier, B. ; Albertini, D. ; Defaÿ, E. ; Verdier, J. ; Barbier, D. ; Carpentier, J.-F.
Author_Institution :
STMicroelectronics, Crolles, France
Abstract :
This paper presents a full characterization of the thermal parameters to improve the thermal Mason´s model for BAW resonator design, in particular, the temperature dependence of the velocity TC(V), the elasticity TC(C33 D), the piezoelectric coefficient TC(e33) and the permittivity TC(¿33) for the AlN film. These parameters associated with the piezoelectric theory assesses the TC(e33) coefficient. To do so, the temperature piezoresponse force microscopy (PFM) technique is used to measure the temperature dependence of the (d33eff) coefficient. The thermal RF measurement is used to characterize the TC(¿33) and the ultrasonic picosecond tool with its heating system is used to characterize the TC(C33 D). Finally, the thermal Mason´s model is compared with the experimental response of the BAW resonator.
Keywords :
acoustic resonators; aluminium compounds; bulk acoustic wave devices; piezoelectric thin films; piezoelectricity; thin film devices; AlN; AlN film elasticity temperature dependence; AlN film permittivity temperature dependence; AlN film piezoelectric coefficient temperature dependence; AlN film velocity temperature dependence; BAW resonator design; aluminium nitride film; piezoelectric theory; piezoresponse force microscopy technique; temperature PFM technique; temperature coefficient piezoelectric constant; thermal 1D acoustic tool; thermal Mason´s model; thermal RF measurement; Elasticity; Force measurement; Heating; Microscopy; Permittivity measurement; Piezoelectric films; Radio frequency; Temperature dependence; Temperature measurement; Ultrasonic variables measurement; AlN; BAW; elasticity constant; permittivity; piezoelectric coefficient e33 and d33; piezoresponse force microscopy (PFM); temperature;
Conference_Titel :
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location :
Rome
Print_ISBN :
978-1-4244-4389-5
Electronic_ISBN :
1948-5719
DOI :
10.1109/ULTSYM.2009.5441505