• DocumentCode
    1994885
  • Title

    High frequency high power density 3D integrated Gallium Nitride based point of load module

  • Author

    Ji, Shu ; Reusch, David ; Lee, Fred C.

  • Author_Institution
    Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
  • fYear
    2012
  • fDate
    15-20 Sept. 2012
  • Firstpage
    4267
  • Lastpage
    4273
  • Abstract
    The Gallium Nitride (GaN) transistors offer the capability of high efficiency at high operation frequency. This paper will discuss the characteristics of enhancement mode and depletion mode GaN transistors; the high frequency GaN converter design considerations include gate driving, reducing dead-time loss, minimizing parasitics inductance, and the three dimension (3D) technology to integrate the active layer with low profile low temperature co-fired ceramic (LTCC) magnetic substrate to achieve high power density. The final demonstrations are two 12 V to 1.2 V conversion integrated point of load (POL) modules: a single-phase10A 800 W/in3 5 MHz converter, a two-phase 20 A 1000 W/in3 5 MHz converter using the depletion mode GaN transistors. These converters offer unmatched power density compared to state-of-the-art industry products and research.
  • Keywords
    III-V semiconductors; MOSFET; ceramic packaging; gallium compounds; inductance; power convertors; wide band gap semiconductors; GaN; LTCC magnetic substrate; active layer; current 10 A; current 20 A; dead-time loss; depletion mode transistors; enhancement mode; frequency 5 MHz; gate driving; high frequency converter design; high frequency high power density 3D integrated gallium niitride; high power density; integrated POL modules; integrated point of load modules; load module; low profile low temperature cofired ceramic magnetic substrate; operation frequency; parasitics inductance; state-of-the-art industry products; three dimension technology; two-phase converter; unmatched power density; voltage 12 V to 1.2 V; Gallium nitride; Inductance; Inductors; Logic gates; Substrates; Threshold voltage; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2012 IEEE
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4673-0802-1
  • Electronic_ISBN
    978-1-4673-0801-4
  • Type

    conf

  • DOI
    10.1109/ECCE.2012.6342242
  • Filename
    6342242