DocumentCode
1995647
Title
Stochastic modeling of a thermally-managed multi-core system
Author
Jung, Hwisung ; Rong, Peng ; Pedram, Massoud
Author_Institution
Dept. of EE-Syst., Southern California Univ., Los Angeles, CA
fYear
2008
fDate
8-13 June 2008
Firstpage
728
Lastpage
733
Abstract
Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new abstract model of a thermally-managed system, where a stochastic process model is employed to capture the system performance and thermal behavior. We formulate the problem of dynamic thermal management (DTM) as the problem of minimizing the energy cost of the system for a given level of performance under a peak temperature constraint by using a controllable Markovian decision process (MDP) model. The key rationale for utilizing MDP for solving the DTM problem is to manage the stochastic behavior of the temperature states of the system under online re-configuration of its micro-architecture and/or dynamic voltage-frequency scaling. Experimental results demonstrate the effectiveness of the modeling framework and the proposed DTM technique.
Keywords
Markov processes; VLSI; integrated circuit modelling; scaling circuits; thermal management (packaging); Markovian decision process; VLSI designers; dynamic thermal management; dynamic voltage-frequency scaling; microarchitecture; multicore system; online re-configuration; stochastic process model; Costs; Dynamic voltage scaling; Energy management; Process control; Stochastic processes; Stochastic systems; System performance; Temperature control; Thermal management; Very large scale integration; Dynamic thermal management; stochastic processes; uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location
Anaheim, CA
ISSN
0738-100X
Print_ISBN
978-1-60558-115-6
Type
conf
Filename
4555915
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