Effect of surface acoustic waves on curing of polyimide films

Author

Yin, Ching-Chung ; Chang, I-Han ; Huang, Kang-Che

Author_Institution

Dept. of Mech. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan

fYear

2009

fDate

20-23 Sept. 2009

Firstpage

815

Lastpage

818

Abstract

This paper presents the surface acoustic wave (SAW) mediated realignment for molecular orientation of polyimide films in curing process. The order parameters of polyimide films were obtained by measuring the anisotropic infrared absorbance using polarized infrared absorption spectroscopy. Experimental results of the double layered specimens indicated that the monomer chains were aligned to parallel to the wave fronts of SAW. The double layered specimens were made of a well cured polyimide film subsequently coated with the second film. The first film provides attractive forces to anchor the molecules of the second polyimide film on the first film. In the present experiments, the molecular orientation order parameter of SAW processed polyimide film is 0.23. It is between the values of unrubbed film (0.069) and rubbed one (0.535).

Keywords

acoustic applications; acoustic streaming; curing; infrared spectra; molecular reorientation; polymer films; radiation pressure; surface acoustic waves; SAW effetcs; SAW mediated realignment; SAW wave front; aligned monomer chains; anisotropic infrared absorbance; polarised infrared absorption spectroscopy; polyimide film curing; polyimide film molecular orientation; polyimide film order parameter; surface acoustic wave; Acoustic measurements; Acoustic waves; Anisotropic magnetoresistance; Curing; Electromagnetic wave absorption; Infrared spectra; Polarization; Polyimides; Spectroscopy; Surface acoustic waves; FTIR; alignment layer; molecular orientation; polyimide; surface acoustic wave;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium (IUS), 2009 IEEE International

Conference_Location

Rome

ISSN

1948-5719

Print_ISBN

978-1-4244-4389-5

Electronic_ISBN

1948-5719

Type

conf

DOI

10.1109/ULTSYM.2009.5441608

Filename

5441608