DocumentCode
1996381
Title
Realization of small and low profile Duplexer using a CSSD packaging technology
Author
Nishizawa, T. ; Endo, G. ; Tajima, M. ; Ono, S. ; Kawachi, O.
Author_Institution
Fujitsu Media Devices Ltd., Yokohama, Japan
fYear
2009
fDate
20-23 Sept. 2009
Firstpage
903
Lastpage
906
Abstract
This paper presents the realization of Duplexer with small size, high reliability and excellent performance. Good heat radiation, hermetic performance and small frequency drift against temperature shift are essential to achieve small size and highly reliable Duplexers. In this paper, we will report on the advantage of the Chip Size SAW Devices (CSSD) structure for miniaturization and high reliability. In addition, we will discuss the possibility of further miniaturization.
Keywords
heat radiation; radio equipment; CSSD packaging technology; chip size SAW devices structure; frequency drift; heat radiation; hermetic performance; low profile duplexer; temperature shift; Chip scale packaging; GSM; Integrated circuit reliability; Multiaccess communication; Radio frequency; Surface acoustic wave devices; Surface acoustic waves; Temperature control; Testing; Thermal conductivity; CSSD; Duplexers; SAW;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2009 IEEE International
Conference_Location
Rome
ISSN
1948-5719
Print_ISBN
978-1-4244-4389-5
Electronic_ISBN
1948-5719
Type
conf
DOI
10.1109/ULTSYM.2009.5441641
Filename
5441641
Link To Document