• DocumentCode
    19978
  • Title

    Physical Connection and Disconnection Control Based on Hot Melt Adhesives

  • Author

    Liyu Wang ; Iida, Fumiya

  • Author_Institution
    Dept. of Mech. & Process Eng., ETH Zurich, Zurich, Switzerland
  • Volume
    18
  • Issue
    4
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    1397
  • Lastpage
    1409
  • Abstract
    Physical connection and disconnection control has practical meanings for robot applications. Compared to conventional connection mechanisms, bonding involving a thermal process could provide high connection strength, high repeatability, and power-free connection maintenance, etc. In terms of disconnection, an established bond can be easily weakened with a temperature rise of the material used to form the bond. Hot melt adhesives (HMAs) are such material that can form adhesive bonds with any solid surfaces through a thermally induced solidification process. This paper proposes a novel control method for automatic connection and disconnection based on HMAs. More specifically, mathematical models are first established to describe the flowing behavior of HMAs at higher temperatures, as well as the temperature-dependent strength of an established HMA bond. These models are then validated with a specific type of HMA in a minimalistic robot setup equipped with two mechatronic devices for automated material handling. The validated models are eventually used for determining open parameters in a feedback controller for the robot to perform a pick-and-place task. Through a series of trials with different wooden and aluminum parts, we evaluate the performance of the automatic connection and disconnection methods in terms of speed, energy consumption, and robustness.
  • Keywords
    adhesive bonding; adhesives; energy consumption; feedback; industrial robots; materials handling equipment; mechatronics; parameter estimation; solidification; HMA; adhesive bonds; aluminum parts; automated material handling; automatic connection; automatic disconnection; connection strength; control method; disconnection control; energy consumption; feedback controller; hot melt adhesives; material temperature rise; mathematical model; mechatronic devices; minimalistic robot setup; open parameter determination; performance evaluation; physical connection; pick-and-place task; power-free connection maintenance; repeatability; robot applications; robustness; solid surfaces; temperature-dependent strength; thermal process; thermally induced solidification process; wooden parts; Bonding; Bonding forces; Heating; Mathematical model; Robots; Solids; Automation; material handling; robot control;
  • fLanguage
    English
  • Journal_Title
    Mechatronics, IEEE/ASME Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4435
  • Type

    jour

  • DOI
    10.1109/TMECH.2012.2202558
  • Filename
    6222361