DocumentCode
1999112
Title
Non invasive measurement of skin hydration and transepidermal water loss in normal skin
Author
Mohamad, Md ; Msabbri, A.R. ; MatJafri, Mohd Zubir
Author_Institution
Sch. of Phys., Univ. Sains Malaysia, Minden, Malaysia
fYear
2012
fDate
3-4 Dec. 2012
Firstpage
859
Lastpage
862
Abstract
Non invasive bioengineering techniques have been used to evaluate Stratum Corneum (SC) hydration and Transepidermal Water Loss (TEWL) in normal skin. Fifteen healthy volunteers aged between 21-27 participated in this study. We conducted a self skin evaluation questionnaire and a noninvasive measurement was performed on the palm, forearm, upper arm and forehead under controlled environment (temperature 21 ± 1 °C, relative humidity 45 ± 5%). Skin hydration was measured with a DermaLab® USB Moisture Module (Cortex Technology, Hadsund, Denmark) and Scalar Moisture Checker MY-808S (Scalar Corporation, Japan) while TEWL measurements were determined using a DermaLab® USB TEWL Module. The areas examined showed skin hydration and TEWL was differed depending on the anatomical sites. The correlations between the parameters were analysed. As a result, no significant correlations between TEWL and skin hydration capacitance were observed. A significant correlation was established between TEWL and conductance.
Keywords
biomedical engineering; biomedical equipment; biomedical measurement; capacitance; electric admittance; skin; solvation; water; DermaLab USB Moisture Module; DermaLab USB TEWL Module; Scalar Moisture Checker MY-808S; TEWL measurements; age 21 yr to 27 yr; anatomical sites; conductance; forearm; forehead; healthy volunteers; noninvasive bioengineering techniques; noninvasive skin hydration measurement; normal skin; palm; relative humidity; self-skin evaluation questionnaire; skin hydration capacitance; stratum corneum hydration; temperature 21 degC; transepidermal water loss; upper arm; Skin hydration; Stratum Corneum (SC); Transepidermal Water Loss (TEWL);
fLanguage
English
Publisher
ieee
Conference_Titel
Humanities, Science and Engineering (CHUSER), 2012 IEEE Colloquium on
Conference_Location
Kota Kinabalu
Print_ISBN
978-1-4673-4615-3
Type
conf
DOI
10.1109/CHUSER.2012.6504435
Filename
6504435
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