Dielectric frequency response of epoxy-based composites with various silica filler sizes

Author

Morshuis, P.H.F. ; Andritsch, T. ; Kochetov, R. ; Fréchette, M.F. ; Martinez, H.D. ; Savoie, S. ; Krivda, A. ; Smith, L.E. ; Zegarac, D.

Author_Institution

Delft Univ. of Technol., Delft, Netherlands

fYear

2010

fDate

4-9 July 2010

Firstpage

1

Lastpage

4

Abstract

Various epoxy-based samples were prepared with different content of micro- and nanosized silica filer. In the case of a constant %-weight content of filler amounting to 65%, the microphase was replaced by a nanophase consisting of 2.5% and 5% weight. Three research teams used dielectric spectroscopy to compare the dielectric behaviour of the different composites. Microstructure analyses of the various epoxy-based compounds using TEM indicated that there was little variance in the homogeneity. The influence of post heat treatment under vacuum was assessed. After post-treatment, all sets of data show similar trends.

Keywords

dielectric materials; heat treatment; nanocomposites; nanofabrication; permittivity; resins; silicon compounds; transmission electron microscopy; TEM; dielectric frequency response; dielectric spectroscopy; epoxy-based composites; homogeneity variance; microsized silica filer; microstructure analyses; nanosized silica filer; post heat treatment; silica filler sizes; Dielectrics; Heat treatment; Nanocomposites; Nanoparticles; Permittivity; Plastics; Silicon compounds; dielectric spectroscopy; epoxy resin; heat treatment; nanocomposites; silica;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid Dielectrics (ICSD), 2010 10th IEEE International Conference on

Conference_Location

Potsdam

Print_ISBN

978-1-4244-7945-0

Electronic_ISBN

978-1-4244-7943-6

Type

conf

DOI

10.1109/ICSD.2010.5568094

Filename

5568094