DocumentCode
2005648
Title
An Asperity-Based Finite Element Model for Electrical Contact of Microswitches
Author
Hong Liu ; Leray, D. ; Pons, P. ; Colin, S.
Author_Institution
Inst. Clement Ader, INSA Toulouse, Toulouse, France
fYear
2013
fDate
22-25 Sept. 2013
Firstpage
1
Lastpage
10
Abstract
Precise prediction of electrical contact resistance is important for microswitches. The contact spot used to be considered as a circle in earlier literature, where there was only one geometrical parameter: the radius of the a-spots. However, a real contact asperity has a height and an angle with the interface. In this paper, a 3-dimensional cone-truncated geometry is used to model an asperity, and three parameters are defined: radius, height and the angle of the side with respect to the surface plane. The ranges of their values are extracted from AFM measurement of samples in Au and Ru, and the values match well with the previous mechanical simulation results. Compared to the theoretical results, the finite element (FE) model showed a good capability to predict contact resistance in the diffusive regime, but underestimated it in the ballistic regime. The effects of angle and height of the asperity were investigated for Au-Ru contact in terms of contact resistance, maximum temperature and its location. Regarding multiple spots in contact, this work investigated the influence of the number of spots and their distributions for contact resistance and local Joule heating.
Keywords
contact resistance; electrical contacts; finite element analysis; gold; microswitches; ruthenium; 3-dimensional cone-truncated geometry; AFM measurement; Au; FE model; Ru; a-spot radius; asperity-based finite element model; ballistic regime; electrical contact resistance; geometrical parameter; local Joule heating; mechanical simulation; microswitches; surface plane; Contact resistance; Finite element analysis; Gold; Microswitches; Resistance; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Holm Conference on Electrical Contacts (HOLM) , 2013 IEEE 59th
Conference_Location
Newport, RI
ISSN
1062-6808
Print_ISBN
978-1-4799-1556-9
Type
conf
DOI
10.1109/HOLM.2013.6651398
Filename
6651398
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