• DocumentCode
    2007197
  • Title

    High performance production of Bi/sub 2/Te/sub 3/ based thermoelectric materials on the route of the bulk mechanical alloying method

  • Author

    Iwaisako, Yasushi ; Aizawa, Tatsuhiko ; Yamamoto, Atsushi ; Ohta, Toshitaka

  • Author_Institution
    Graduate Sch. of Eng., Tokyo Univ., Japan
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    234
  • Lastpage
    237
  • Abstract
    In the commercial fabrication of thermoelectric materials, melting, ingot-making, pulverizing and sintering are fundamental steps for production. In the present new production method on the route of bulk mechanical alloying, the elemental constituent granules or agglomerates with any selected composition can be used for direct solid-state synthesis into single or dual phase thermoelectric materials. The Bi-Te-Sb system is adopted as the target thermoelectric material to investigate the effect of fine-grained structure on the figure of merit. In addition, temperature and pressure conditions in hot pressing are widely varied to describe the effect of process parameters on the thermoelectric properties. As a rough sketch of high performance in this processing, 3.6 ks for fabrication of green compact with the relative density of 85% T.D., 3.6 ks for hot pressing to have fine grain size in 1/spl sim/2 /spl mu/m for high density of 99% T.D. or more, and Z=3.15/spl times/10/sup -3//K in p-type Bi-Te system for the highest figure of merit.
  • Keywords
    bismuth compounds; grain size; hot pressing; mechanical alloying; sintering; thermoelectricity; Bi/sub 2/Te/sub 3/; figure of merit; fine-grained structure; green compact; hot pressing; ingot-making; mechanical alloying; melting; pulverizing; sintering; thermoelectric materials; Alloying; Bismuth; Composite materials; Fabrication; Grain size; Pressing; Production; Solid state circuits; Temperature; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843376
  • Filename
    843376