• DocumentCode
    2007994
  • Title

    Thermoelectric properties of Ru-based oxides with a layered structure

  • Author

    Matsubara, I. ; Funahashi, R. ; Yamada, H. ; Ueno, K.

  • Author_Institution
    Osaka Nat. Res. Inst., Japan
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    411
  • Lastpage
    413
  • Abstract
    RuSr/sub 2/GdCu/sub 2/O/sub 8/ (Ru-1212) has a layered structure in which insulating CuO/sub 2/ plane and conductive RuO/sub 3/ plane are piled up alternatively. Thermoelectric properties of Ru-1212 have been evaluated from room temperature to 600/spl deg/C and these results are compared with those of SrRuO/sub 3/ with a three dimensional perovskite structure. SrRuO/sub 3/ shows a metallic /spl sigma/-T behavior, whereas a semiconducting-like transport is observed in the Ru-1212. At temperatures T<400/spl deg/C, the Seebeck coefficient values of Ru-1212 are larger than those of SrRuO/sub 3/ by more than twice. The thermal conductivity of Ru-1212 is lower than that of SrRuO/sub 3/ whole the measured temperature range. In the viewpoint of Seebeck coefficient and thermal conductivity, making an insulating/conducting superlattice structure is effective to enhance the thermoelectric performance.
  • Keywords
    Seebeck effect; ruthenium compounds; semiconductor materials; strontium compounds; thermal conductivity; thermoelectric power; 20 to 600 C; RuSr/sub 2/GdCu/sub 2/O/sub 8/; Seebeck coefficient; conductive RuO/sub 3/ plane; insulating CuO/sub 2/ plane; layered structure; semiconducting-like transport; thermal conductivity; thermoelectric properties; Conducting materials; Conductivity measurement; Force measurement; Inorganic materials; Insulation; Semiconductor materials; Superlattices; Temperature measurement; Thermal conductivity; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843417
  • Filename
    843417