• DocumentCode
    2008446
  • Title

    A membrane type Si-MEMS tactile imager with fingerprint structure for realization of slip sensing capability

  • Author

    Okada, Hiroki ; Yawata, Masaki ; Ishida, Makoto ; Sawada, Kazuaki ; Takao, Hidekuni

  • Author_Institution
    Toyohashi Univ. of Technol., Toyohashi, Japan
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    608
  • Lastpage
    611
  • Abstract
    This paper reports a newly developed Si-MEMS integrated tactile imager that can detect tri-axial input force and `slip´ on the surface of the sensor in high spatial resolution (several hundreds micron). Tactile imaging is performed by a large area silicon membrane which is integrating sensor pixel array including strain gauge circuits. The new imager device presented in this paper has fingerprint-like patterns formed by Deep-RIE on the silicon sensor diaphragm. The patterns generate a rotational motion for horizontal axis input force, and it is similar with the role of human´s fingerprints. Basic principle of the tactile imager was examined with FEM analysis for multi-axis input forces and the slip sensing ability. In addition, tri-axial load was successfully detected in each pixel by the new membrane sensor structure with low cross-axis sensitivities.
  • Keywords
    finite element analysis; microsensors; tactile sensors; FEM analysis; Si-MEMS integrated tactile imager; fingerprint structure; fingerprint-like patterns; high spatial resolution; horizontal axis input force; imager device; large area silicon membrane; membrane sensor structure; microelectromechanical system; rotational motion; sensor pixel array; silicon sensor diaphragm; slip sensing ability; slip sensing capability; strain gauge circuits; tactile imaging; tri-axial input force; tri-axial load; Biomembranes; Fingerprint recognition; Force sensors; High-resolution imaging; Image sensors; Pixel; Sensor arrays; Silicon; Spatial resolution; Tactile sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442333
  • Filename
    5442333