DocumentCode
2008448
Title
Table of contents
fYear
2011
fDate
8-12 May 2011
Firstpage
1
Lastpage
15
Abstract
The following topics are dealt with: chip-package-interaction; low-k films; reliability; memories; integrated circuit interconnect; 3D integration; process integration; power and automotive interconnect; and metal gate.
Keywords
integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated memory circuits; low-k dielectric thin films; power integrated circuits; three-dimensional integrated circuits; 3D integration; automotive interconnect; chip-package-interaction; integrated circuit interconnect; integrated circuit reliability; low-k films; memories; metal gate; power interconnect; process integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Conference_Location
Dresden
ISSN
pending
Print_ISBN
978-1-4577-0503-8
Type
conf
DOI
10.1109/IITC.2011.5940255
Filename
5940255
Link To Document