• DocumentCode
    2008669
  • Title

    Power electronics loss measurement using new heat flux sensor based on thermoelectric device with active control

  • Author

    Zhang, Yichao ; Jahns, T.M.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI, USA
  • fYear
    2012
  • fDate
    15-20 Sept. 2012
  • Firstpage
    97
  • Lastpage
    104
  • Abstract
    A new approach is presented for measuring the heat dissipation in power electronic devices using a commercial thermoelectric (TE) module as a heat flux sensor. The proposed sensor takes advantage of both the Seebeck and Peltier thermoelectric effects, yielding a new type of heat flux sensor with low thermal resistance and appealing accuracy/resolution characteristics. In order to explain the operating principles of this sensor, attention is focused on the model of the thermoelectric module and the method of controlling it as a heat flux sensor. The measured performance of early prototype versions of the sensor exhibits promising agreement with the calculated characteristics. Key performance metrics of the new heat flux sensor can be enhanced using new generations of thin-film thermoelectric modules that offer advantages compared to conventional modules using arrays of bulk TE material pellets.
  • Keywords
    Seebeck effect; cooling; electric sensing devices; heat measurement; loss measurement; power electronics; power measurement; temperature sensors; thermal resistance; thermoelectric devices; thin film transistors; Peltier thermoelectric effect; Seebeck thermoelectric effect; TE module; accuracy-resolution characteristic; active control; bulk TE material pellet; heat dissipation measurement; heat flux sensor; power electronics loss measurement; thermal resistance; thin-film thermoelectric module; Current measurement; Heating; Junctions; MOSFET circuits; Temperature measurement; Temperature sensors; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2012 IEEE
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4673-0802-1
  • Electronic_ISBN
    978-1-4673-0801-4
  • Type

    conf

  • DOI
    10.1109/ECCE.2012.6342836
  • Filename
    6342836