• DocumentCode
    2008783
  • Title

    Doping effect of metal into iron disilicide on electronic structures and thermoelectric properties

  • Author

    Sugihara, S. ; Kawashima, S. ; Katanahara, H. ; Suzuki, H. ; Mochizuki, S. ; Sekine, R.

  • Author_Institution
    Shonan Inst. of Technol., Fujisawa, Japan
  • fYear
    1999
  • fDate
    Aug. 29 1999-Sept. 2 1999
  • Firstpage
    577
  • Lastpage
    580
  • Abstract
    Doping effects of elements into FeSi/sub 2/ on the electronic structures were studied relating to the thermoelectric properties. The studied elements were the metals possessing d- or f-electrons such as Mn, Co, Zn and Hf, W, os (f/sup 14/ series) and Nd, Eu and Yb in the lanthanide series, although only Yb, Hf and Os are reported here. The calculation was performed using the discrete variational X/spl alpha/ molecular orbital method. The energy gap between the highest occupied molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) relates to electrical conductivity, and the Seebeck coefficient associated with the gap between HOMO and LUMO levels possessing the same symmetry which were degenerate. In experiment, doping with Yb/sub 2/O/sub 3/ increased the Seebeck coefficient and electrical resistivity did not change much, resulting in an improvement as large as twice the figure of merit for thermoelectricity.
  • Keywords
    Seebeck effect; Xalpha calculations; electrical resistivity; energy gap; iron compounds; semiconductor materials; FeSi/sub 2/; HOMO-LUMO energy gap; Seebeck coefficient; discrete variational X/spl alpha/ calculations; electrical conductivity; electronic structure; figure of merit; thermoelectricity; Conducting materials; Doping; Electric resistance; Hafnium; Iron; Neodymium; Orbital calculations; Thermal conductivity; Thermoelectricity; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1999. Eighteenth International Conference on
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-5451-6
  • Type

    conf

  • DOI
    10.1109/ICT.1999.843455
  • Filename
    843455