Shear microprobing of chip-package interaction in advanced interconnect structures

Chip-package interaction has become an increasingly important concern due to higher reflow temperatures of Pb-free solders and the heterogeneous integration of materials with vastly different properties. In particular, shear stresses are common during the packaging process. In this study, a microprobe metrology system is used to assess the mechanics of advanced interconnect structures under shear loading. This allows for a better understanding of the robustness of interconnect structures and the stresses they can tolerate.