Drop-shock dynamic analysis of MEMS/package system

Author

Yang, Chen ; Zhang, Bin ; Chen, Dajing ; Lin, Liwei

Author_Institution

Univ. of California at Berkeley, Berkeley, CA, USA

fYear

2010

fDate

24-28 Jan. 2010

Firstpage

520

Lastpage

523

Abstract

This paper presents multi-scale analysis for a MEMS package system with experimental verifications to investigate dynamic responses under drop-shock tests. Dynamic responses such as acceleration waves of MEMS package in macro-scale are measured as the inputs of MEMS structures in micro-scale for numerical simulations. Structural deformation and stress distribution data are extracted and predicted. Possible applications include device fracture and in-operation stiction predictions for micro mechanical components in various MEMS sensors, including accelerometers and gyroscopes. We present results with MEMS accelerometers inside QFN packages.

Keywords

accelerometers; electronics packaging; micromechanical devices; reliability; MEMS accelerometer; MEMS package system; MEMS sensor; QFN package; acceleration wave; drop-shock dynamic analysis; gyroscope; multiscale analysis; stress distribution; structural deformation; Acceleration; Accelerometers; Data mining; Gyroscopes; Mechanical sensors; Micromechanical devices; Numerical simulation; Packaging; Stress; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on

Conference_Location

Wanchai, Hong Kong

ISSN

1084-6999

Print_ISBN

978-1-4244-5761-8

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2010.5442450

Filename

5442450