Title :
A novel vertical solder pump structure for through-wafer interconnects
Author :
Gu, Jiebin ; Pike, W.T. ; Karl, W.J.
Author_Institution :
Dept. of EEE, Imperial Coll. London, London, UK
Abstract :
Through wafer interconnection is a critical technology for advanced packaging. Previously, we have proposed a solder pump technology which could complete the via filling through solder reflow. Here, an improved vertical solder-pump structure is presented and successfully demonstrated. This technology allows producing an arbitrary array of highly conductive vias in seconds.
Keywords :
integrated circuit interconnections; integrated circuit packaging; reflow soldering; advanced packaging; solder reflow; through-wafer interconnects; vertical solder pump structure; Copper; Educational institutions; Feeds; Filling; Gravity; Metallization; Packaging; Potential energy; Surface tension; Vents;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
Conference_Location :
Wanchai, Hong Kong
Print_ISBN :
978-1-4244-5761-8
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2010.5442457
