DocumentCode
2011601
Title
PADRE: Physically-Aware Diagnostic Resolution Enhancement
Author
Yang Xue ; Poku, Osei ; Xin Li ; Blanton, R.D.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2013
fDate
6-13 Sept. 2013
Firstpage
1
Lastpage
10
Abstract
Diagnosis is the first step of IC failure analysis. The conventional objective of identifying the failure locations has been augmented with various physically-aware techniques that are intended to improve both diagnostic resolution and accuracy. Despite these advances, it is often the case however that resolution, i.e., the number of locations or candidates reported by diagnosis, exceeds the number of actual failing locations. Imperfect resolution greatly hinders any follow-on, information-extraction analyses (e.g., physical failure analysis, volume diagnosis, etc.) due to the resulting ambiguity. To address this major challenge, a novel, unsupervised learning methodology that uses ordinarily-available tester and simulation data is described that significantly improves resolution with virtually no negative impact on accuracy. Simulation experiments using a variety of fault types (SSL, MSL, bridges, opens and cell-level input-pattern faults) reveal that the number of failed ICs that have perfect resolution can be more than doubled, and overall resolution is improved by 22%. Application to silicon data also demonstrates significant improvement in resolution (38% overall and the number of chips with ideal resolution is nearly tripled) and verification using PFA demonstrates that accuracy is maintained.
Keywords
circuit analysis computing; failure analysis; fault diagnosis; integrated circuit reliability; unsupervised learning; IC failure analysis; PADRE; PFA; diagnostic resolution; failure locations; information-extraction analysis; physical failure analysis; physically-aware diagnostic resolution enhancement techniques; silicon data; simulation data; unsupervised learning methodology; Abstracts; Equations; Mathematical model;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference (ITC), 2013 IEEE International
Conference_Location
Anaheim, CA
ISSN
1089-3539
Type
conf
DOI
10.1109/TEST.2013.6651899
Filename
6651899
Link To Document