DocumentCode
2011786
Title
HPC application in 3D parameter extraction and hard IP migration for DSM IC design
Author
Zhuang, Wenjun ; Foo, Han Yang ; Shi, Qian
Author_Institution
Inst. of High Performance Comput., Singapore
Volume
2
fYear
2000
fDate
14-17 May 2000
Firstpage
1150
Abstract
Entering the era of deep sub-micron, Singapore has put a lot of effort into the development of design and manufacturing capability in the microelectronics industry. The Institute of High Performance Computing has invested in manpower, high-performance computing hardware, and state-of-the-art EDA CAD tools to assist and support local microelectronics industry in applications such as 3D parameter extraction and hard IP migration.
Keywords
circuit CAD; integrated circuit design; logic CAD; parallel processing; 3D parameter extraction; DSM IC design; EDA CAD tools; Singapore; deep sub-micron; hard IP migration; high-performance computing; microelectronics industry;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Computing in the Asia-Pacific Region, 2000. Proceedings. The Fourth International Conference/Exhibition on
Conference_Location
Beijing, China
Print_ISBN
0-7695-0589-2
Type
conf
DOI
10.1109/HPC.2000.843616
Filename
843616
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