Peltier effect in sub-micron-sized metallic junctions

Author

Fukushima, A. ; Kubota, H. ; Yamamoto, A. ; Suzuki, Y. ; Yuasa, S.

Author_Institution

Nat. Inst. of Adv. Ind. Sci. & Technol.

fYear

2006

fDate

6-10 Aug. 2006

Firstpage

242

Lastpage

246

Abstract

Heating in sub-micron-sized electronic circuits becomes a serious problem, especially in high-density integrated circuits (IC). A cooling method, which can suppress the heating inside the electronic circuits, is strongly required. Recently we reported [Fukushima, A, et. al., 2005; Fukushima, A, et. al., 2005] that Peltier cooling in sub-micron-sized current-perpendicular-to-plane metallic-junctions (CPP-MJ) with Co/Au and Cr/Au interfaces, and found that estimated Peltier coefficients of CPP-MJs are larger than those of bulk materials. In this presentation, we report the progress of our recent works on Peltier effects in sub-micron-sized CPP-MJs

Keywords

Peltier effect; cooling; electrical contacts; integrated circuits; CPP-MJ; Co-Au; Cr-Au; Peltier coefficients; Peltier cooling; Peltier effect; cobalt-gold interface; cooling method; copper-gold interface; plane perpendicular current metallic junctions; submicron-sized electronic circuit heating; submicron-sized metallic junctions; Chromium; Computer integrated manufacturing; Cooling; Current measurement; Electrical resistance measurement; Gold; Heating; Pulse measurements; Shape; Thermoelectricity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermoelectrics, 2006. ICT '06. 25th International Conference on

Conference_Location

Vienna

ISSN

1094-2734

Print_ISBN

1-4244-0811-3

Electronic_ISBN

1094-2734

Type

conf

DOI

10.1109/ICT.2006.331360

Filename

4133279