DocumentCode
2012631
Title
ERT imaging and linkage to CFD for stirred vessels in the chemical process industry
Author
Mann, R.
Author_Institution
Sch. of Chem. Eng. & Anal. Sci., Univ. of Manchester, Manchester
fYear
2009
fDate
11-12 May 2009
Firstpage
218
Lastpage
222
Abstract
Stirred vessels in the chemical process industry are largely devoid of instrumentation, which can visualise the internal concentrations and phase distribution. An electrical resistance tomography (ERT) system installed on a 1 metre/1 tonne scale pilot plant vessel is described. Some earlier applications showing how fluid mixing and precipitation can be imaged in time and space using solid-body graphics are described based on pseudo-3D assembly of several axial sensing planes. Simplified computational fluid dynamics (CFD) provides a density of predictions, which is commensurate with the multiple interior point detail O (103) furnished by the ERT system. More recent improvements are portrayed, which use full 3D interrogation of the fluid space coupled with fully 3D reconstruction from a set of peripheral measurements. Simplified CFD also emphasises the potential for ERT imaging of batch-fed bioreactors. Potential future developments of this imaging technology are briefly presented.
Keywords
batch processing (industrial); bioreactors; chemical industry; computational fluid dynamics; computer graphics; electrical resistivity; image reconstruction; mixing; precipitation; tomography; 3D reconstruction; CFD; ERT imaging technology; batch-fed bioreactors; chemical process industry; computational fluid dynamics; electrical resistance tomography system; fluid mixing; precipitation; pseudo3D assembly; solid-body graphics; stirred vessels; Chemical industry; Chemical processes; Computational fluid dynamics; Couplings; Electric resistance; Graphics; Instruments; Space technology; Tomography; Visualization; CFD; ERT; chemical process; mixing; visualisation;
fLanguage
English
Publisher
ieee
Conference_Titel
Imaging Systems and Techniques, 2009. IST '09. IEEE International Workshop on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-3482-4
Electronic_ISBN
978-1-4244-3483-1
Type
conf
DOI
10.1109/IST.2009.5071637
Filename
5071637
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