• DocumentCode
    2013460
  • Title

    Monolithic integration of carbon nanotubes based physical sensors

  • Author

    Lin, Chia-Min ; Lin, Li-Yuan ; Fang, Weileun

  • Author_Institution
    Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    24-28 Jan. 2010
  • Firstpage
    55
  • Lastpage
    58
  • Abstract
    This study establishes a batch fabricated process to implement and monolithically integrate CNTs (carbon nanotubes) based physical sensors. In this process, vertically aligned CNTs (not horizontally aligned or mixed CNTs) are grown and patterned on Si-wafer as sensing elements, and also integrated with MEMS (microelectromechanical systems) structures. The mechanical deformation and temperature change is thus detected by the resistance change of such CNTs sensing elements. In applications, the CNTs-based pressure sensor and temperature sensor are monolithically fabricated on a chip. Preliminary measurements indicate the presented CNTs-based piezoresistive pressure sensor has a gauge factor of ~20, and the sensitivity of CNTs-based temperature sensor is 0.19/°C.
  • Keywords
    carbon nanotubes; deformation; micromechanical devices; monolithic integrated circuits; nanotube devices; pressure sensors; temperature sensors; CNT sensing elements; CNT-based piezoresistive pressure sensor; CNT-based temperature sensor; MEMS structures; Si-wafer; batch fabrication process; carbon nanotubes monolithic integration; gauge factor; mechanical deformation; microelectromechanical systems; physical sensors; sensing elements; sensitivity; temperature sensor; vertically aligned CNT; Carbon nanotubes; Chemical elements; Electrical resistance measurement; Mechanical sensors; Microelectromechanical systems; Micromechanical devices; Monolithic integrated circuits; Pressure measurement; Semiconductor device measurement; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2010 IEEE 23rd International Conference on
  • Conference_Location
    Wanchai, Hong Kong
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-5761-8
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2010.5442566
  • Filename
    5442566