• DocumentCode
    2013645
  • Title

    Electronic Transport Properties of Sn-doped CoSb3 Prepared by Encapsulated Induction Melting

  • Author

    Jae-Yong Jung ; Mi-Jung Kim ; Sin-Wook You ; Soon-Chul Ur ; Il-Ho Kim

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Chungju Nat. Univ., Chungbuk
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    447
  • Lastpage
    450
  • Abstract
    Te-doped CoSb3 skutterudites were prepared by encapsulated induction melting, and their thermoelectric and electronic transport properties were investigated. Single delta-phase was successfully obtained by the subsequent annealing at 773K for 24 hours. Seebeck coefficient and Hall coefficient confirmed that all the Te-doped CoSb3 showed the n-type conductivity. Te atoms successfully acted as electron donors by substituting Sb atoms. Seebeck coefficient and electrical resistivity decreased with increasing the Te content. Thermal conductivity was considerably reduced by doping due to the electron-phonon scattering and the lattice contribution was dominant over the electronic contribution. Dimensionless thermoelectric figure of merit was remarkably improved by Te doping and Te atom is a very effective dopant for CoSb3 skutterudite
  • Keywords
    Hall effect; Seebeck effect; annealing; cobalt compounds; electrical resistivity; electron-phonon interactions; melting; semiconductor doping; semiconductor materials; tellurium; thermal conductivity; 24 hours; 773 K; CoSb3:Te; Hall coefficient; Seebeck coefficient; annealing; electrical resistivity; electron donors; electron-phonon scattering; electronic transport; encapsulated induction melting; semiconductor doping; skutterudites; thermal conductivity; thermoelectricity; Conductivity measurement; Doping; Electric resistance; Electric variables measurement; Impurities; Magnetic field measurement; Scattering; Thermal conductivity; Thermoelectricity; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331311
  • Filename
    4133326