• DocumentCode
    2014555
  • Title

    Numerical Analysis of Effective Thermal Conductivity in Microwire Array Element

  • Author

    Kuraishi, M. ; Komine, T. ; Teramoto, T. ; Sugita, R. ; Hasegawa, Y.

  • Author_Institution
    Dept. of Media & Telecomm. Eng., Ibaraki Univ., Hitachi
  • fYear
    2006
  • fDate
    6-10 Aug. 2006
  • Firstpage
    582
  • Lastpage
    585
  • Abstract
    In this study, we have developed a three-dimensional finite element method for solving the equations of electrical and thermal flows. The 3D analysis of bulk material and wire array element was demonstrated, and electrical potential and temperature distributions were calculated in thermoelectric elements of bulk bismuth and wire array structures for various boundary conditions. The influence of wire array structure on effective thermal conductivity of the element was discussed in this study. It was clarified that thermal exchange between bismuth wire and glass template in wire array element plays a very important role for reduction of thermal conductivity
  • Keywords
    bismuth; electric potential; finite element analysis; thermal conductivity; thermoelectricity; 3D finite element method; Bi; bismuth; effective thermal conductivity; electrical flows; electrical potential; microwire array element; thermal exchange; thermal flows; thermoelectric elements; Bismuth; Conducting materials; Electric potential; Equations; Finite element methods; Numerical analysis; Temperature distribution; Thermal conductivity; Thermoelectricity; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2006. ICT '06. 25th International Conference on
  • Conference_Location
    Vienna
  • ISSN
    1094-2734
  • Print_ISBN
    1-4244-0811-3
  • Electronic_ISBN
    1094-2734
  • Type

    conf

  • DOI
    10.1109/ICT.2006.331381
  • Filename
    4133360