DocumentCode
2014555
Title
Numerical Analysis of Effective Thermal Conductivity in Microwire Array Element
Author
Kuraishi, M. ; Komine, T. ; Teramoto, T. ; Sugita, R. ; Hasegawa, Y.
Author_Institution
Dept. of Media & Telecomm. Eng., Ibaraki Univ., Hitachi
fYear
2006
fDate
6-10 Aug. 2006
Firstpage
582
Lastpage
585
Abstract
In this study, we have developed a three-dimensional finite element method for solving the equations of electrical and thermal flows. The 3D analysis of bulk material and wire array element was demonstrated, and electrical potential and temperature distributions were calculated in thermoelectric elements of bulk bismuth and wire array structures for various boundary conditions. The influence of wire array structure on effective thermal conductivity of the element was discussed in this study. It was clarified that thermal exchange between bismuth wire and glass template in wire array element plays a very important role for reduction of thermal conductivity
Keywords
bismuth; electric potential; finite element analysis; thermal conductivity; thermoelectricity; 3D finite element method; Bi; bismuth; effective thermal conductivity; electrical flows; electrical potential; microwire array element; thermal exchange; thermal flows; thermoelectric elements; Bismuth; Conducting materials; Electric potential; Equations; Finite element methods; Numerical analysis; Temperature distribution; Thermal conductivity; Thermoelectricity; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2006. ICT '06. 25th International Conference on
Conference_Location
Vienna
ISSN
1094-2734
Print_ISBN
1-4244-0811-3
Electronic_ISBN
1094-2734
Type
conf
DOI
10.1109/ICT.2006.331381
Filename
4133360
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