Submicron Mechanically Planarized Shallow Trench Isolation With Field Shield

Author

Linderiberger, W.S. ; Kornblit, A. ; Lai, W. ; Hillenius, S.J. ; Chen, M.-L.

Author_Institution

AT&T Bell Laboratories, PA

fYear

1991

fDate

28-30 May 1991

Firstpage

Lastpage

Keywords

Breakdown voltage; Circuit testing; Dielectrics; Dry etching; Fabrication; Hydrogen; Printing; Resists; Silicides; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1991. Digest of Technical Papers., 1991 Symposium on

Conference_Location

Oiso, Japan

Type

DOI

10.1109/VLSIT.1991.706004

Filename

706004

Link To Document