Study of enhanced plastic ball grid array (EPBGA) package with heat spreader of copper plane

Finite element models of heat spreader enhanced plastic ball grid array (EPBGA) packages with different structures, materials and process treatments had been developed in this study. Predicted result indicated that the difference of stress were not significant generated in the structures with single-layer and double-layer spreader respectively. The stress became smaller gradually with the increasing of glue thickness. Moreover, the encapsulation material of CV5420 brought less stress for package than FP4654. The result of reliability test revealed that product using the spreader dealt with ENEPIG all failed after reflowed three times, which had the worst reliability. Plasma proved beneficial to the reliability of package. The performance of 2200 was better than that of 2100A and 2300. Finally, the optimal structure design and material collocation were achieved for the EPBGA package.