Abstract :
The following topics are dealt with: advanced failure analysis; backend reliability; gate dielectrics; MEMS; device reliability.
Keywords :
dielectric materials; failure analysis; integrated circuit reliability; micromechanical devices; MEMS; advanced failure analysis; backend reliability; device reliability; gate dielectrics; integrated circuits failure;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location :
Bangalore
Print_ISBN :
978-1-4244-1014-9
DOI :
10.1109/IPFA.2007.4378047
