• DocumentCode
    2016975
  • Title

    Package on Package SMT rework technology

  • Author

    Yuchuan, Wang ; Qiang, Chen

  • Author_Institution
    Samsung Semiconductor (china)R&D., LTD, Jiangsu Suzhou, China
  • fYear
    2015
  • fDate
    11-14 Aug. 2015
  • Firstpage
    74
  • Lastpage
    78
  • Abstract
    While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity, and seems likely to be implemented in other types of electronic assemblies. In order to improve the SMT rework yield for PoP devices, rework process and reliability study was undertaken. The first goal of this study was to establish the process guideline for PoP SMT rework. The second goal of this study was to assess the reliability of reworked package.
  • Keywords
    Packaging; PoP(Pacakge on Package); Rework; SMT; TMV(though mold via);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
  • Conference_Location
    Changsha, China
  • Type

    conf

  • DOI
    10.1109/ICEPT.2015.7236548
  • Filename
    7236548
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2016975