DocumentCode
2017389
Title
Reliability Challenges in Analog and Mixed Signal Technologies
Author
Chaparala, P. ; Brisbin, D. ; Jonggook Kim ; OConnell, Barry
Author_Institution
Nat. Semicond. Corp., Santa Clara
fYear
2007
fDate
11-13 July 2007
Abstract
Unique analog product application requirements such as high speed, low noise, low power, high precision and high voltage demand complex analog process technologies. This complexity poses several reliability challenges that are specific to each technology. In this paper some of the key reliability mechanisms in most common analog process technologies are highlighted. To meet broad range of analog IC reliability requirements, in-depth device reliability characterization is essential besides the traditional process reliability qualification.
Keywords
analogue integrated circuits; integrated circuit reliability; mixed analogue-digital integrated circuits; analog IC reliability; analog process technologies; in-depth device reliability; mixed signal technologies; reliability mechanisms; Analog circuits; CMOS technology; Circuit testing; Degradation; Digital circuits; Human computer interaction; Niobium compounds; Paper technology; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2007. IPFA 2007. 14th International Symposium on the
Conference_Location
Bangalore
Print_ISBN
978-1-4244-1014-9
Type
conf
DOI
10.1109/IPFA.2007.4378073
Filename
4378073
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