The finite element simulation and nanoindentation methods for the study of mechanical behavior of lead-free solder joints

Nanoindentation experiment together with the finite element simulation was used to study the mechanical behavior of Sn3.0Ag0.5Cu (SAC305) lead-free solder joint under cyclic loading-unloading. The effect of different maximum loads and holding time on the micromechanics behavior was investigated. The results indicated that the increase of the maximum load caused the increase of the depth of residual indentation and the area of hysteresis loop. The creep displacement of solder joint was increased with the prolonging of holding time. It increased sharply at first, and then went stabilized. In addition, a good agreement between finite element model and experimental results was reached.