DocumentCode
2018325
Title
The role of component packaging in system electromagnetic compatibility
Author
Hubing, Todd
Author_Institution
Missouri Univ., Rolla, MO, USA
fYear
1994
fDate
2-4 Nov 1994
Firstpage
49
Lastpage
50
Abstract
Increases in the speed and density of electronic systems do not necessarily result in tougher electromagnetic compatibility problems. In fact, recent advances in packaging technology can help designers to meet electromagnetic compatibility requirements. However, working with new technologies requires us to re-evaluate existing EMC design models and guidelines. Understanding the system-level impact of component-level packaging changes, is a prerequisite for meeting stringent electromagnetic compatibility requirements in a timely and cost-effective manner
Keywords
packaging; EMC design models; component packaging; electromagnetic compatibility; electronic systems; Circuits; Clocks; Electromagnetic compatibility; Electromagnetic modeling; Electronics packaging; Frequency; Guidelines; Signal design; Space technology; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
Conference_Location
Monterey, CA
Print_ISBN
0-7803-2411-0
Type
conf
DOI
10.1109/EPEP.1994.594068
Filename
594068
Link To Document