Study on application of strain measuring technology in PCBA reliability evaluation

It is essential to understand that excessive strain usually results in various failure modes for printed circuit board assembly (PCBA) products. However, it is often difficult to measure the true strains of the critical component solder joints´ connections on PCBAs directly. Based on analysis of the basic principle for strain gage test technology and strain-induced damage phenomena of PCBAs, this article studied on the application of strain measuring technology in reliability evaluation of PCBA under manufacturing process. Moreover, combining with an applicative example of strain measurement during mechanical assembly, systematic analysis was conducted on the strain gage selection technology for PCBA, specific operation method of strain gage tests during PCBA assembly process and strain data analysis method, in order to make further improvement on strain evaluation methodology in electronic industry.