DocumentCode
2019257
Title
Platinum silicide as electrode material of microfabricated quantum electron tunneling transducers
Author
Balan, Nikita N. ; Ivashov, Evgenii N. ; Nevskii, Alexander B.
Author_Institution
Vneshtechnika FSUE, Moscow, Russia
fYear
2010
fDate
June 30 2010-July 4 2010
Firstpage
159
Lastpage
164
Abstract
The platinum silicide is proposed as electrode material for electrostatically controlled MEMS/NEMS, in our case - for nanoelectromechanical sensors based on quantum electron tunneling. The process flow of device fabrication is presented and reasons to use platinum silicide as metallization material are described. In this paper we also demonstrate the use of conductive atomic force micoscopy (AFM) in spreading resistance imaging mode for inspection of topography and electrical properties of platinum silicide surface. The goal of this study is to define the platinum silicide films structural and electrical properties variation after thermal processing (conventional operation in CMOS process flow) and to correct the process flow parameters as may be required. Both AFM-inspection operations of pre- and post-thermal processed test structures are performed. The experimental results are presented.
Keywords
atomic force microscopy; microfabrication; nanoelectromechanical devices; platinum compounds; quantum optics; atomic force micoscopy; device fabrication; electrical properties variation; electrode material; electrostatically controlled MEMS/NEMS; metallization material; microfabrication; nanoelectromechanical sensors; platinum silicide surface; quantum electron tunneling transducers; resistance imaging; thermal processing; CMOS integrated circuits; Heating; Laser modes; Measurement by laser beam; Micromechanical devices; Seminars; Transducers; AFM; MEMS; NEMS; STM; platinum silicide; spreading resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro/Nanotechnologies and Electron Devices (EDM), 2010 International Conference and Seminar on
Conference_Location
Novosibirsk
Print_ISBN
978-1-4244-6626-9
Type
conf
DOI
10.1109/EDM.2010.5568840
Filename
5568840
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