DocumentCode
2019375
Title
Effect of CeO2 particles on the medium phosphorus electroless Ni layer
Author
Zheng Zhen ; An Rong ; Zhou Wei ; Zhou Shuya ; Wang Chunqing
Author_Institution
State Key Lab. of Adv. Welding & Joining, Harbin Inst. of Technol., Harbin, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
471
Lastpage
475
Abstract
Add CeO2 in medium phosphorus content Ni-P composite coating has been attracted attention in recent years. So, we add different amounts and different size of CeO2 in the nickel plating solution, then the morphology and crystal structure of the coating are characterize by scanning electron microscope (SEM) and X-ray diffraction analysis (XRD) respectively. As a result, the content of CeO2 in the coating increases with the rise of the CeO2 concentration, moreover the grain of the Ni coating turns to amorphous state and the grain got refined. Finally, the corrosion resistance of the coating was tested with the method of Electrochemical impedance (EIS) and linear polarization. Both methods get same result. The corrosion resistance of the coating enhances greatly after added CeO2 in the plating solution. Different diameter of CeO2 got different corrosion resistance, however mirco-CeO2 got better performance which may due to micro-CeO2 could refine the grain of the coating more efficient.
Keywords
X-ray diffraction; amorphous state; cerium compounds; coatings; corrosion resistance; crystal morphology; electrochemical impedance spectroscopy; grain refinement; nickel; particle size; phosphorus; scanning electron microscopy; CeO2; EIS; SEM; X-ray diffraction; XRD; amorphous state; composite coating; corrosion resistance; crystal morphology; crystal structure; electrochemical impedance spectroscopy; grain refinement; linear polarization; medium phosphorus electroless Ni layer; nickel plating solution; particle size effect; scanning electron microscopy; Coatings; Corrosion; Lead; Resistance; CeO2 particles; Corrosion Resistance; Electroless Ni; medium Phosphorus;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha
Type
conf
DOI
10.1109/ICEPT.2015.7236629
Filename
7236629
Link To Document