• DocumentCode
    2020339
  • Title

    Limitations of electromagnetic-based package analysis tools

  • Author

    Rubin, Barry J.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    1994
  • fDate
    2-4 Nov 1994
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    Through the use of specially designed problems that stress package analysis codes, the author provides valuable insight and shows users how to determine if their codes are providing the correct solutions to their packaging problems
  • Keywords
    packaging; EMI; conducting cube; contact resistance structure; current loop; dipole; electromagnetic-based package analysis tools; electronic packaging; inductive loop; leakage field; mesh planes; moment based codes; numerical grid; Automatic testing; Electromagnetic analysis; Electronics packaging; Frequency; Inductance; Permeability; Scattering; Sensitivity analysis; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic packaging, 1994., IEEE 3rd Topical Meeting on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-2411-0
  • Type

    conf

  • DOI
    10.1109/EPEP.1994.594076
  • Filename
    594076
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2020339