DocumentCode
2020666
Title
The numerical investigation on the stiffness of CuCGA interconnection under the condition of shearing
Author
Zhao, Zhili ; Liu, Yingjie ; Yang, Jianguo ; Dai, Wenqin
Author_Institution
Harbin University of Science and Technology, School of Materials Science & Engineering, China
fYear
2015
fDate
11-14 Aug. 2015
Firstpage
685
Lastpage
688
Abstract
In this paper, the effect of the number and the spacing for copper columns to the copper column grid array (CuCGA) interconnection structure under the condition of shearing load was discussed by the means of nonlinear finite element method (FEM). The results as follows: Shear force increases significantly with the increase of shear displacement in the process of shearing, and according to the variation of the slope for curve of shear force-shear displacement, the curve can be divided into 3 stages before fracture occurring; With the increase of the number of copper columns, the slope for curve of shear force-shear displacement increase, which means the stiffness of the CuCGA interconnection structure increases with the increase of the number of copper columns. And with the increase of spacing for copper columns, the stiffness of CuCGA interconnection structure increase.
Keywords
Arrays; Bonding; Copper; Finite element analysis; Force; Shearing; Strain; CuCGA; number of copper columns; shear force; spacing of copper columns;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2015 16th International Conference on
Conference_Location
Changsha, China
Type
conf
DOI
10.1109/ICEPT.2015.7236678
Filename
7236678
Link To Document